This Terms of Service agreement (“Agreement”) is entered into between HpAndroid Scholarship, its affiliates, and its users (“User”). By accessing and using the HpAndroid Scholarship website at hpandroid.co.id/scholarship (“Website”), the User agrees to comply with and be bound by the terms and conditions set forth in this Agreement.
1. Acceptance of Terms
By accessing and using the Website, the User acknowledges that they have read, understood, and agreed to be bound by this Agreement. If the User does not agree to all the terms and conditions of this Agreement, they are not permitted to use the Website.
2. Intellectual Property
All content and materials on the Website, including but not limited to text, graphics, logos, images, and software, are the property of HpAndroid Scholarship and are protected by applicable intellectual property laws. The User may only use such content and materials for personal and non-commercial purposes.
3. User Obligations
The User agrees to comply with all applicable laws and regulations when using the Website. They must not engage in any activity that may disrupt or interfere with the Website’s operation or compromise its security.
4. Disclaimer
The Website and its content are provided on an “as is” basis without any warranties, express or implied. HpAndroid Scholarship makes no representations or warranties regarding the accuracy, reliability, or completeness of the content on the Website.
5. Limitation of Liability
In no event shall HpAndroid Scholarship be liable for any direct, indirect, incidental, consequential, or punitive damages arising out of or in connection with the User’s use of the Website. This includes any damages resulting from accessing or downloading any content or materials from the Website.
6. Governing Law
This Agreement shall be governed by and construed in accordance with the laws of the United States, without regard to its conflict of laws principles. Any dispute arising out of or in connection with this Agreement shall be resolved exclusively by the courts located in the United States.
7. Contact
If you have any questions or concerns regarding this Agreement, please contact us at [email protected].